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- sliver vs slither
- resolution problem
- Pad expansion
- Set soldermask relief to zero
- A key point when inspecting a new pcb supplier is soldermask over pad
- might do negative soldermask relief over BGA
- Adding numbers to
- escaping BGA
- Via in pad impacts cost
- Plugging vias
- EEVblog video about BGA fanout
- tools for automated fanout
- Pin swapping
- 1000 orders per day
- KiCad live stream
- Embedded/Macrofab crossover show
- Matt from Autodesk EAGLE is trying to take on footprints/modules in new versions of the software
- Possible footprint solutions
- “I’ve bitten myself”
- Dave got a new custom LCD!
- Holtec driver
- Sam Zeloof
- Things Network
- Richard Ginus
- What is Hardware Studio?
- Scott Miller
- Zach Dunham
- Recent article about Hardware Studio
- Chris proposes they use a rubrick to determine if projects make sense.
- Manufacturing: First, Be Perfect
- Stamp on the page wouldn’t have mattered
What service did Dave use for those 5 boards delivered?
Why do we need soldermask between pads?
To my understanding is only required if there are traces in between that get exposed. FR4 resin is epoxy like soldermask. I can only imagine a difference of texture as FR4 surface is rough for better adhesion… or maybe creepage distance, as it creates a bump. But solder gets adhered to metal and surface tension cleans spaces in between.
With fine pitch parts is just not possible, and if you reduce the clearance misalignment can get it over some pad and create a coplanarity problem.
I might be doing it wrong¿? My assemblers have never complained about it.
I only use it to confine solder within the pad, to avoid migration through traces or planes during reflow. But solder only migrates through metal.
Carl Smith says
I have to wonder, if Dave did start an “EEVBlog Approved” certification for Kickstarter projects, would he open himself up to liability if the project fails?
John Pitney says
Wednesday’s Digi-Key email featured a Maxim MAX32660 Cortex-M4F in a 1.6mm by 1.6mm wafer-level 16-bump package.