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You are here: Home / Guest Appearance / #531 – Footprints and Symbols with Natasha Baker

#531 – Footprints and Symbols with Natasha Baker

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Welcome, Natasha Baker, Founder and CEO of SnapEDA!

  • Natasha has an EE background, she got her start working on tools at National Instruments
  • She was reading IPC-7351 specs early on. What’s in there?
  • All about how to create footprints, with different density levels, depending on the complexity of your board
    • Most
    • Nominal
    • Neast
  • A new version is coming out soon, check IPC.org for more info
  • With corporate sponsorship, anyone can participate (and Natasha recommends it!)
  • Interesting discussion around using an X shaped pad under a QFP
  • Later, Natasha got interested in the marketing side of business.
  • She found that she was designing board and footprints taking a ton of time
  • Zen and the Art of Motorcycle Maintenance
    • Gumption
    • Craftsmanship
  • When Natasha started, she was coding it herself. She taught herself using a Django tutorial meant for a website that organizes books. It still has some form on the current site.
  • A site like SnapEDA is difficulat because it’s starting from no content. They had free “requests” to figure out what people wanted early on. They had some user generated models at the beginning, but they were not preferred.
  • Natasha estimates there are nearly 1 billion parts in the ecosystem, in part because of the number of connector companies permutations.
  • Semiconductor acquisitions has messed with a lot of part number data.
  • Natasha took SnapEDA through the yCombinator program, focusing on it full time. We have had two shows in the past about YC
    • Luke Iseman, former head of hardware at YC
    • The Upverter team, who also went through YC
  • YC has continued funding hardware companies since then, even though SaaS have been more popular
  • Eric Migicovski, founder of Pebble, is now running hardware at YC
  • During interviews with engineers, trust was the biggest/most common thing brought up
  • SnapEDA has a neutral meta format, which means each component goes through a PCB exporter to match your specific CAD tool.
  • Chris didn’t realize there is a batch export for KiCad. This will be less necessary for the upcoming v6 version. There is also a KiCad plugin.
  • Natasha hopes in the future they can offer additional engineering content
    • Simulation models
    • IBIS
    • Subcircuits
  • Microdecisions
  • Working with old school chip companies
  • Component registrations
  • Free samples
  • Analytics/Insights
  • Lizard brain vs logical brain
  • 40% browse parts directly through site. Others arrive via external search engines. There are tools built directly into ExpressPCB and Proteus. SnapEDA created external plugins for Altium and KiCad.
  • InstaBuild allows engineers to pull pin tables out of datasheet PDFs. The resulting symbol is only available to the user who created it (for now, at least)
  • Popularity of platforms using SnapEDA (in order)
    1. Altium
    2. EAGLE
    3. Orcad/KiCad/Allegro (tied for 3rd)
  • Launching some cool things in the next month or so
  • SnapEDA has published about popular components via EETimes in the past.
  • Feedback welcome! You can reach them via the SnapEDA chat bubble (on the site), via email at support@snapeda.com, or via the “report issues” dialog on each part page

Comments

  1. Sergey says

    February 23, 2021 at 4:11 am

    My respect to Natasha, but when she is saying that Snap eda can be used as it is without checking- don’t believe it. I found a many many mistakes there – mirrored footprints, origin placed on pin1 instead of the center (this is where centroid name comes from!), wrong 3D models, wrong footprints. Looks like they use interns to make all of this.

    Reply
  2. vincent himpe says

    February 23, 2021 at 10:12 am

    IPC is overrated. They are years behind the industry and are in conflict with their own documents. According to the land-pattern standard the toe of a pin should land within the pad, according to their manufacturing standard it is ok for the toe to stick out beyond the pad … go figure. And for many packages the toe is non-wettable anyway.
    As for snapeda : their symbols suck. Connectors are just a rectangular blob , often the pin order is wrong. The order should be as it is on the connector. Integrated circuits same thing. Nothing is grouped by function, pin names are incomplete. Opamps need to be drawn as an opamp , not a blob.

    Their footprints do not follow IPC . They are still using the dot for pin one while IPC has moved to a line or corner mark. for BGA three corners should be marked with the pin 1 corner left unmarked so the AOI can position check. Also : the courtyards are defined wrong. A courtyard needs to encapsulate ALL objects and that includes silkscreen. It is also heavily advised to use rounded rectangle pads as opposed to rectangles since it gives better paste release.

    Reply
  3. vincent himpe says

    February 23, 2021 at 10:18 am

    On components that have thermal pads: there needs to be a windowpane design for the paste mask and a thermal via farm.

    Reply
  4. Adrian says

    February 23, 2021 at 2:01 pm

    Great show and great guest.

    That being said, I squirmed when Chris asked whether Natasha can push vendors to provide a standardized way to get symbols, parts, models. Be careful what you wish for!

    I think there’s a big danger of creating another middle man’s walled garden. IMO, vendors and distributors relying on services like SnapEDA instead of offering open format data on their website is no better, if not worse than Ultra Librarian, and definitely a step back from today’s situation. The benefits of a symbiosis between SnapEDA and vendors are not automatically aligned with the interests of the lay engineer.

    Reply
    • vincent himpe says

      February 23, 2021 at 2:22 pm

      It wouldn’t be that hard to have an open format.
      [] denotes choice of 1
      denotes optional parameter

      FOOTPRINT,[NAME],[MM/MILS]
      SMTPAD,[TOP/BOTTOM],X,Y,LENGTH,WIDTH, ,,
      PAD,X,Y,[ROUND,RECTANGLE],X,Y,LENGTH,WIDTH,HOLESIZE,,
      LINE,[COURTYARD,ASSEMBLY,TOPSILK,BOTTOMSILK],WIDTH,X1,Y1,X2,Y2
      VIA,X,Y,holesize,ringsize
      RECTANGLE,[SOLDERMASK,PASTEMASK],x1,y1,x2,y2
      MODEL,[FILENAME_IN_SAME_DIRECTORY]

      you don’t need more than that to make footprints
      a simple parsing script can translate that into your cad package format.

      Reply
      • vincent himpe says

        February 23, 2021 at 2:25 pm

        same for symbols:
        PART,[DESIGNATOR],[NAME],[FOOTPRINT]
        PIN[NORTH,EAST,SOUTH,WEST],NUMBER,NAME
        LINE,x1,y1,x2,y2
        RECTANGLE,x1,y1,x2,y2,INNERCOLOR,OUTERCOLOR
        ARC,X,Y,RADIUS,STARTANGLE,STOPANGLE

        Reply

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