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- Dave had a recent video about selecting different op amps for the microcurrent (maintaining engineering!)
- ADI buying Maxim
- Maxim sampling policy
- Will there be a large amount of crossover parts?
- Microchip sent out a letter asking for better visibility into the backlog
- Boards with stackup
- Video about reviewing PCBs of forum member
- Chris borrowed an idea from past guest Luke Valenty about how to use pill shaped pads on the tinyfpga bx. This enables using a larger
- Process for PCBs
- “Lowest common denominator design” is the idea of choosing a PCB fab that has a very small space/trace, but only needing it for the
- smallest chip.
- CSP – Chip Scale Package
- “Putting the EV in EEVblog” (looking at electric vehicles)
- Dave bought a teardown report of the BMW i3 on Leandesign.com and it’s awesome.
- Forensic teardowns
- Intel video inside the chip fab
- We were sad to hear that Grant Imahara passed away last week. Watch his former co-host Adam Savage talk about memories of Grant.
Sandy Munro, boss of leandesign.com is a kindred spirit of Mr eevblog and would make an excellent guest on the Amp Hour.
Both guys make YouTube tear downs, worked on military projects and toasters.
If you put both of these “no bullshit” guys on the same episode and let them talk, you will have more than an hour of great entertainment.
I’ve been in a similar situation regarding PCB design specs. I’ve been working for a while on a GPSDO add-on for my rubidium standard, it was supposed to have a built-in GPS receiver (ublox module) so at first provided a footprint for the module itself. But at the same time I wanted to use a cheap manufacturing service and a two-layer PCB so the antenna feed line became a bit of a problem. Microstrip on a 1.6mm PCB is not really doable in a 50 Ohm system so I tried a CPWG, but those are only viable if you can put a PCB edge connector (not possible due to mechanical constraints).. Eventually, I decided to put the ublox module on a small breakout board that would be done as a 4 layer PCB. The GPSDO board would be done in two layers. This turned out to be the better solution.
Heads up, after filling in the form the tear down report price was offered to me at the reduced cost of $150,000 USD. No insomnia curing reading for me.
Updated the link, this is the proper one: https://munrolive.com/support-%2F-store/ols/products/bmw-i3-reports